Microscopy Today Presents: Up to 40% Faster Automated TEM Lamella Preparation with new Tescan Ga⁺ FIB Column
Tags: FIB-SEM, semiconductor, materials science, electron microscopy
Speaker: Lukas Hladik
Resource Link: https://vimeo.com/1148138505?autoplay=1&muted=1&stream_id=Y2xpcHN8NDMwNjk4NDB8aWQ6ZGVzY3xbXQ%3D%3D