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(17:00 CET / 11:00 ET - United States)

Join Tescan's Lukas Hladik for a guided introduction to Tescan Orage 2™, the new generation Ga+ FIB column in the updated SOLARIS 2 FIB-SEM microscope. You will see how Orage 2™ raises throughput and precision in TEM sample preparation and cross-sectioning for advanced logic and memory devices, and how Tescan TEM AutoPrep™ Pro, automates the complete lamella workflow from trench milling through lift-out to the final low keV cleaning. With optimized spot size at higher beam currents, Orage 2™ enables up to 40% faster TEM specimen preparation, while clear imaging at 500 eV supports confident control and reliable placement during the final FIB cleaning. The session features examples from semiconductor applications, including complex 3D NAND and 3 nm FinFET devices.

What You'll Learn

• How TEM AutoPrep™ Pro, an AI-driven software module, enables fully automated TEM lamella preparation without user intervention
• How the Tescan Orage 2™  Ga+ FIB column makes TEM lamella preparation and cross-sectioning up to 40% faster with higher consistency in outcome quality
• See high quality, TEM lamellae of complex 3D NAND, 3 nm FinFET devices and other samples in semiconductor applications

This Webinar is For

• Researchers, quality control and failure analysis engineers working on advanced logic and memory devices
• Specialists preparing TEM lamellae from complex 3D structures such as 3D NAND and the latest FinFET devices
• FIB-SEM users who want to explore current innovations in automation workflows

Orage 2™ combines speed, precision, and automation to make advanced TEM lamella preparation faster, more accessible, and consistently reliable.

Meet the Speaker

Lukas Hladik is one of Tescan’s leading experts in semiconductor applications, supporting customers in addressing complex challenges across failure analysis, and process development.